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US 2020/0286809 A1Published application
Carbon-pad thermal-interface materials in multi-die packages
AssigneeIntel Corporation
InventorsShushan Gong, James C. Matayabas, JR.
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Abstract
Multi-die semiconductor device packages include a solder thermal interface material for a processor device, and a carbon-pad thermal interface material for a high-bandwidth memory device. Disparate dice are packaged against a heat sink on the device backsides, and on a semiconductor package substrate on the device active surfaces and metallizations.
Claims21
A semiconductor device package, comprising:
- a first semiconductive device on a semiconductor package substrate;
- a heat sink contacting the first semiconductive device through a metal alloy thermal interface material (TIM);
- a subsequent semiconductive device on the semiconductor package substrate;
- a carbon-pad thermal interface material (carbon-pad TIM) contacting the heat sink from a backside of the subsequent semiconductive device, wherein the carbon-pad TIM is configured under compression.
1 more element
A computing system, comprising:
- a first semiconductive device on a semiconductor package substrate, wherein the first semiconductive device is a processor die;
- a heat sink contacting the first semiconductive device at a die backside metallurgy and through a solder thermal interface material (sTIM);
- a subsequent semiconductive device on the semiconductor package substrate, wherein the subsequent semiconductive device is a high-bandwidth memory die;
- a carbon-pad thermal interface material (carbon-pad TIM) contacting the high-bandwidth memory die at a backside at bulk semiconductive material, wherein the carbon-pad TIM also contacts the heat sink, wherein the carbon-pad TIM is configured under compression from the heat sink;
- a third semiconductive device on the semiconductor package substrate, wherein the third semiconductive device is contacted by a carbon-pad TIM at a third-die at a backside at bulk semiconductive material;
- and
- wherein the first, subsequent and third semiconductive devices are part of a chipset.
4 more elements
21-22. (canceled)
Dependencies are inferred from the claim text.