Plug-in type power module and subsystem thereof
AssigneeIndustrial Technology Research Institute
InventorsShu-Jung Yang, Yu-Lin Chao, Chun-Kai Liu, Ming Kaan Liang, Jiin Shing Perng
Life of this patent
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Abstract
A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.
Claims21
1-34. (canceled)
A plug-in type power module, comprising:
- a power unit;
- and
- a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit, and a printed circuit structure provided between the power unit and the heat-transfer unit, wherein heat generated by the power unit is transferred from the printed circuit structure to the heat-transfer unit to increase the speed of heat dissipation,
- wherein the power unit further includes:
- a portion of a second interconnect provided on the printed circuit structure, and at least one chip provided on the portion of the second interconnect and electrically connected to the portion of the second interconnect to allow signal transmission to be performed therebetween;
- a first molding compound provided on the printed circuit structure and around the chips to fix the chips in place, and a portion of the second interconnect and I/O contacts provided on the printed circuit structure, the chips and the first molding compound;
- a second molding compound provided on the portion of the second interconnect and the first molding compound and between the I/O contacts;
- and
- a third molding compound provided underneath the I/O contacts and at two sides of the power unit and the heat-transfer unit to encapsulate and protect the power unit and the heat-transfer unit.
A plug-in type power module, comprising:
- a power unit;
- and
- a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit, and a thick copper layer provided between the power unit and the heat-transfer unit, wherein heat generated by the power unit is transferred from the thick copper layer to the heat-transfer unit to increase the speed of heat dissipation,
- wherein the power module comprises:
- a second interconnect provided on the thick copper layer, and at least one chip provided on the thick copper layer, wherein the second interconnect is electrically connected to the chip and the thick copper layer to allow signal transmission to be performed therebetween;
- and
- a first molding compound provided on the thick copper layer and around the chips to fix the chips in place, and a portion of the second interconnect and I/O contacts provided on the thick copper layer, the chips and the first molding compound.
Dependencies are inferred from the claim text.