Integrated heat spreader comprising a silver and sintering silver layered structure

An integrated circuit device package comprising:

• a package substrate;
• an integrated circuit die coupled with contacts on a surface of the package substrate;
• a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die;
• a second material layer comprising a second metal over the first material layer;
• and
• a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer, wherein there is a metallurgical junction between a first of the silver particles and the first metal, or between a second of the silver particles and the second metal.

A computing system comprising:

• a system board;
• a memory coupled with the system board;
• and
• an integrated circuit device package coupled with the system board, the integrated circuit device package comprising:
• a package substrate;
• an integrated circuit device coupled with contacts on a surface of the package substrate;
• a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die;
• and
• an integrated heat spreader, the integrated heat spreader comprising:
• a second material layer comprising a second metal over the first material layer;
• and
• a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer, wherein there are metallurgical junctions between a first of the silver particles and the first metal and between a second of the silver particles and the second metal.