Back to results
US 2020/0286804 A1Published application
Method and apparatus to control temperature of a semiconductor die in a computer system
AssigneeIntel Corporation
InventorsJohn FALLIN, Daniel J. RAGLAND, Jonathan P. DOUGLAS
Life of this patent
Estimating the term…
Abstract
Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.
Claims20
An apparatus comprising:
- a die to operate in an overclocked mode;
- and
- circuitry to apply supplemental heat to the die while a die junction temperature is below an operating temperature range for the die junction temperature.
A method comprising:
- applying power to a die;
- and
- applying supplemental heat to the die while a die junction temperature is below an operating temperature range for the die junction temperature.
A system comprising:
- a processor;
- a display communicatively coupled to the processor;
- and
- circuitry to apply supplemental heat to the processor while a die junction temperature in the processor is below an operating temperature range for the die junction temperature.
1 more element
Dependencies are inferred from the claim text.