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US 2020/0286799 A1Published application
Semiconductor device and manufacturing method thereof
AssigneeMitsubishi Electric Corporation
InventorHiroyuki MASUMOTO
Life of this patent
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Abstract
A semiconductor device includes: a semiconductor chip; a case storing the semiconductor chip; a wire bonded to the semiconductor chip; a cover fixed inside the case and including a concave portion disposed above the semiconductor chip and the wire; and a sealing resin potted inside the case and sealing the semiconductor chip, the wire and the cover, wherein the sealing resin is not filled in the concave portion so that a cavity is provided.
Claims18
A semiconductor device comprising:
- a semiconductor chip;
- a case storing the semiconductor chip;
- a wire bonded to the semiconductor chip;
- a cover fixed inside the case and including a concave portion disposed above the semiconductor chip and the wire;
- and
- a sealing resin potted inside the case and sealing the semiconductor chip, the wire and the cover,
- wherein the sealing resin is not filled in the concave portion so that a cavity is provided.
4 more elements
A method of manufacturing a semiconductor device comprising:
- storing a semiconductor chip in a case;
- bonding a wire to the semiconductor chip;
- fixing a cover inside the case so that a concave portion of the cover is disposed above the semiconductor chip and the wire;
- and
- potting a sealing resin inside the case to seal the semiconductor chip, the wire and the cover,
- wherein the sealing resin is not filled in the concave portion so that a cavity is provided.
3 more elements
Dependencies are inferred from the claim text.