Wafer dicing using femtosecond-based laser and plasma etch

A system for dicing a semiconductor wafer comprising a plurality of integrated circuits, the system comprising:

• a cluster tool, comprising:
• a deposition chamber;
• a robotic transfer chamber coupled to the deposition chamber;
• and
• a load lock;
• a laser scribe apparatus;
• and
• a factory interface coupled to the robotic transfer chamber of the cluster tool by the load lock of the cluster tool, and the factory interface coupled to the laser scribe apparatus, wherein the factory interface comprises a robot with an arm or a blade, wherein a semiconductor wafer is transferred from the deposition chamber to the robotic transfer chamber of the cluster tool, from the robotic transfer chamber of the cluster tool to the robot of the factory interface through the load lock of the cluster tool, and from the robot of the factory interface to the laser scribe apparatus.