Cyclic flowable deposition and high-density plasma treatment processes for high quality gap fill solutions

A cluster tool for processing a substrate, comprising:

• a load lock chamber;
• a transfer chamber coupled to the load lock chamber;
• a plurality of first processing chambers coupled to the transfer chamber, wherein each of the first processing chambers is a deposition chamber capable of performing a flowable layer deposition;
• a plurality of second processing chambers coupled to the transfer chamber, wherein each of the second processing chambers is a curing chamber capable of performing a thermal curing process;
• and
• a plurality of third processing chambers coupled to the transfer chamber, wherein each of the third processing chambers is a plasma chamber capable of performing a plasma curing process.

A cluster tool for processing a substrate, comprising:

• a load lock chamber;
• a transfer chamber coupled to the load lock chamber;
• a plurality of first processing chambers coupled to the transfer chamber, wherein each of the first processing chambers is a plasma chemical vapor deposition chamber capable of performing a flowable layer deposition of a silicon-containing dielectric layer;
• a plurality of second processing chambers coupled to the transfer chamber, wherein each of the second processing chambers is a UV-light curing chamber capable of performing a thermal curing process;
• and
• a plurality of third processing chambers coupled to the transfer chamber, wherein each of the third processing chambers is an inductively coupled plasma (ICP) chamber capable of performing a plasma curing process.