Sputtering processing and apparatus
AssigneeRokko Systems Pte Ltd
InventorsJong Jae JUNG, Yun Suk SHIN, Deok Chun JANG
Life of this patent
Estimating the term…
Abstract
A process for sputtering a plurality of integrated circuit (“IC”) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.
Claims18
A process for sputtering a plurality of integrated circuit (“IC”) units, the process comprising the steps of:
- applying a layer to a holding ring;
- cutting an array of apertures in the layer;
- transferring the holding ring to a template positioned within a placement station;
- aligning said array of apertures with an array of recesses in said template;
- delivering IC units to said holding ring, each IC unit corresponding to an aligned aperture and recess, and
- applying a sputtering process to said IC units engaged with said holding ring.
A placement station comprising:
- a template having an array of recesses;
- said template arranged to receive a holding ring having an array of apertures;
- said apertures and recesses arranged to align so as to receive a plurality of integrated circuit (“IC”) units for sputtering.
Dependencies are inferred from the claim text.