Microelectronic assemblies

A microelectronic assembly, comprising:

• a package substrate;
• a conductive plane in the package substrate;
• and
• a die having a first surface with first conductive contacts and an opposing second surface with second conductive contacts, wherein the die is embedded in the package substrate, wherein the second surface of the die is in contact with the conductive plane, and wherein the first and second conductive contacts are coupled to conductive pathways in the package substrate.

A microelectronic assembly, comprising:

• a package substrate, the package substrate comprising:
• a first dielectric layer having first conductive contacts on a first surface,
• a second dielectric layer having second conductive contacts on a second surface, and
• a conductive layer having a top surface and an opposing bottom surface, wherein the top surface of the conductive layer is in contact with the first surface of the first dielectric layer and the bottom surface of the conductive layer is in contact with the second surface of the second dielectric layer, and wherein the conductive layer includes a cavity having the second conductive contacts of the second dielectric layer at the bottom of the cavity;
• and
• a die having a first surface with first conductive contacts and an opposing second surface with second conductive contacts, wherein the die is embedded in the cavity in the conductive layer, and wherein the first conductive contacts on the first surface of the die are electrically coupled to the second conductive contacts on the second dielectric layer and the second conductive contacts on the second surface of the die are electrically coupled to the first conductive contacts on the first dielectric layer.