Method of fabricating package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChia-Hsiang Lin, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Arunima Banerjee
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Abstract
A package structure including a semiconductor die, a redistribution layer and a plurality of conductive elements is provided. At least one joint of the joints in the redistribution layer or on the semiconductor die is connected with the conductive element for electrically connecting the redistribution layer, the semiconductor die and the conductive elements. The fabrication methods for forming a package structure are provided.
Claims20
A method for forming a package structure, comprising:
- providing a carrier having a first dielectric layer formed thereon;
- forming a second dielectric layer having at least one opening over the first dielectric layer;
- forming at least one block over the carrier within the at least one opening;
- forming a first seed layer over the second dielectric layer, the at least one opening and the at least one block;
- forming a metallic pattern on the first seed layer and filling the at least one opening;
- removing the carrier to expose the first dielectric layer;
- removing the first dielectric layer and exposing the metallic pattern;
- and
- forming at least one conductive ball on the exposed metallic pattern.
A method for forming a package structure, comprising:
- forming a first dielectric layer on a carrier, wherein the first dielectric layer has a depression formed therein without exposing the carrier;
- forming a second dielectric layer having an opening over the first dielectric layer, wherein the opening exposes the depression and portions of the first dielectric layer;
- forming a seed layer over the second dielectric layer, the opening, the exposed portions and the depression of the first dielectric layer;
- forming a metallic pattern on the seed layer, wherein forming the metallic pattern includes filling the depression to form a stud portion and filling the opening to form a plug portion connected with the stud portion;
- removing the carrier to expose the first dielectric layer;
- removing the first dielectric layer and portions of the second dielectric layer and the seed layer to expose portions of the metallic pattern;
- and
- forming a conductive ball on the exposed portions of the metallic pattern.
A method for forming a package structure, comprising:
- forming a first dielectric layer having a first opening over a wafer, wherein the first opening exposes a conductive feature of the wafer;
- forming a first seed layer over the first dielectric layer, the first opening and the conductive feature;
- forming a second dielectric layer having a second opening on the first seed layer and over the first dielectric layer, wherein the second opening exposes portions of the first seed layer and the first opening;
- forming a metallic portion on the first seed layer by filling the first and second openings;
- removing the second dielectric layer and removing the first seed layer not covered by the metallic portion;
- forming a second seed layer over the first dielectric layer and the metallic portion;
- forming a metallic stud portion on the second seed layer and over the metallic portion;
- removing the second seed layer not covered by the metallic stud portion;
- and
- forming a conductive ball on the metallic portion covering the metallic stud portion and the remained second seed layer.
Dependencies are inferred from the claim text.