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US 2020/0286741 A1Published application
Multi-Chip Structure and Method of Forming Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Der-Chyang Yeh
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Abstract
A device includes a first chip is embedded in a molding compound layer, wherein the first chip is shifted toward a first direction, a second chip over the first chip and embedded in the molding compound layer, wherein the second chip is shifted toward a second direction opposite to the first direction and a plurality of bumps between the first chip and the second chip.
Claims20
A device comprising:
- a molding compound layer, the molding compound layer having a first sidewall and a second sidewall opposite to the first sidewall;
- a first chip embedded in the molding compound layer, wherein a first sidewall of the first chip is coplanar with the first sidewall of the molding compound layer, and wherein a second sidewall of the first chip is spaced apart from the second sidewall of the molding compound layer;
- and
- a second chip over the first chip and embedded in the molding compound layer, wherein a first sidewall of the second chip is coplanar with the second sidewall of the molding compound layer, and wherein a second sidewall of the second chip is spaced apart from the first sidewall of the molding compound layer.
1 more element
A device comprising:
- a molding compound layer;
- a first chip embedded in the molding compound layer, a first sidewall of the first chip being in physical contact with the molding compound layer;
- and
- a second chip over the first chip and embedded in the molding compound layer, a first sidewall of the second chip being in physical contact with the molding compound layer, wherein a portion of the first chip extends beyond the first sidewall of the second chip, and wherein a portion of the second chip extends beyond the first sidewall of the first chip.
1 more element
A method comprising:
- attaching a first chip to a carrier;
- bonding a second chip to the first chip;
- and
- encapsulating the first chip and the second chip in a molding compound layer, the molding compound layer being in physical contact with a first sidewall of the first chip and a first sidewall of the second chip, wherein a portion of the first chip extends beyond the first sidewall of the second chip, and wherein a portion of the second chip extends beyond the first sidewall of the first chip.
1 more element
Dependencies are inferred from the claim text.