Chucking process and system for substrate processing chambers

A method of chucking one or more substrates in a substrate processing chamber, comprising:

• applying a chucking voltage to a pedestal using a preselected value, with a substrate disposed on a support surface of the pedestal;
• detecting an impedance shift;
• determining a refined chucking voltage based on the impedance shift;
• and
• adjusting the applied chucking voltage using the refined chucking voltage.

A controller for substrate processing chamber systems, comprising:

• a processor;
• and
• a set of computer instructions that, when executed, instruct the processor to:
• cause a direct current voltage generator to apply a chucking voltage to a pedestal,
• cause an impedance detector to detect an impedance shift of a radio frequency energy generator, and
• determine a refined chucking voltage based on the impedance shift.