Multiple electron beam inspection apparatus and multiple electron beam inspection method

A multiple electron beam inspection apparatus comprising:

• a secondary electron image acquisition mechanism that acquires a secondary electron image by applying multiple primary electron beams to a substrate where figure patterns are formed, and detecting multiple secondary electron beams emitted from the substrate by irradiation with the multiple primary electron beams;
• a correction circuit that corrects a partial secondary electron image of partial secondary electron images which configure the secondary electron image such that the partial secondary electron image becomes close to a uniform beam partial image which is acquired by the secondary electron image acquisition mechanism in a case where an irradiation region of a primary electron beam corresponding to the partial secondary electron image is irradiated with a uniform beam obtained by equalizing shapes and sizes of all primary electron beams of the multiple primary electron beams, using a function for individual correction of each primary electron beam of the multiple primary electron beams, for each of the partial secondary electron images;
• and
• an inspection circuit that performs inspection using the partial secondary electron images each corrected.