Magnetic component structure with thermal conductive filler and method of fabricating the same
AssigneeCyntec Co., Ltd.
InventorsYi-Ting Lai, Jen-Chuan Hsiao, Yuan-Ming Chang, Hsieh-Shen Hsieh
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Abstract
An magnetic component structure with thermal conductive filler is provided in the present invention, including an upper magnetic core, a lower magnetic core combining with the upper magnetic core to form a casing with a front opening and a rear opening, and a coil mounted in the casing, where two terminals of the coil extend outwardly from the front opening, and a thermal conductive filler filling between the casing and the coil in the casing.
Claims22
A magnetic component structure with thermal conductive filler, comprising:
- an upper magnetic core;
- a lower magnetic core, wherein said upper magnetic core and said lower magnetic core combines to form a casing with a front opening and a rear opening;
- a coil mounted in said casing, where two terminals of said coil extending outwardly from said front opening;
- and
- a thermal conductive filler filling between said casing and said coil in said casing.
A method of fabricating a magnetic component structure with thermal conductive filler, comprising:
- providing a mold with a coil mounted therein;
- potting said mold with a thermal conductive material to form a thermal conductive filler encapsulating at least a portion of said coil;
- releasing said thermal conductive filler and said coil from said mold;
- and
- combining said thermal conductive filler with magnetic cores to form a magnetic component structure.
A method of fabricating a magnetic component structure with thermal conductive filler, comprising:
- providing a mold comprising an upper magnetic core and a lower magnetic core with a coil mounted therein;
- potting said mold with a thermal conductive material to form a thermal conductive filler encapsulating at least a portion of said coil.
Dependencies are inferred from the claim text.