Semiconductor defect inspection apparatus and semiconductor defect inspection method
AssigneeToshiba Memory Corporation
InventorKiminori YOSHINO
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AssigneeToshiba Memory Corporation
InventorKiminori YOSHINO
Estimating the term…
According to one embodiment, a semiconductor defect inspection apparatus includes: an object-under-examination stage on which an inspection target object is placed; an X-ray irradiation unit that irradiates the object-under-examination stage with X-rays; an imaging unit that detects transmitted X-rays which passed through the inspection target object; a fluorescent X-ray detection unit that detects fluorescent X-rays which are emitted from the inspection target object by irradiation with the X-rays; and a defect detection unit that detects a first defect by an analysis of a transmission X-ray image which is obtained by performing photoelectric conversion of the transmitted X-rays and detects a second defect by a spectrum analysis of the fluorescent X-rays.
A semiconductor defect inspection apparatus comprising:
A semiconductor defect inspection method, comprising:
A system comprising:
Dependencies are inferred from the claim text.