Amorphous thin metal film

A method, comprising depositing the amorphous thin metal film to a substrate, the amorphous thin metal film, comprising:

• 5 at % to 90 at % of a metalloid, wherein the metalloid is carbon, silicon, or boron;
• 5 at % to 90 at % of a first metal, wherein the first metal is titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum;
• and
• 1 at % to 90 at % of cerium,
• wherein the metalloid, the first metal, and cerium account for at least 50 at % of the amorphous thin metal film.

A thermal inkjet printhead stack with an amorphous thin metal film, comprising:

• an insulated substrate;
• a resistor applied to the insulated substrate;
• a resistor passivation layer applied to the resistor;
• and
• a protective layer applied to the resistor passivation layer,
• wherein the resistor, the protective layer, or both include the amorphous thin metal film, said amorphous thin metal film, comprising:
• 5 at % to 90 at % of a metalloid, wherein the metalloid is carbon, silicon, or boron;
• 5 at % to 90 at % of a first metal, wherein the first metal is titanium, vanadium, chromium, iron, cobalt, nickel, zirconium, niobium, molybdenum, ruthenium, rhodium, palladium, hafnium, tantalum, tungsten, osmium, iridium, or platinum;
• and
• 1 at % to 90 at % of cerium,
• wherein the metalloid, the first metal, and cerium account for at least 50 at % of the amorphous thin metal film.