Stress reduction during laser resealing through a temperature increase

A method for producing a micromechanical component that includes a substrate and a cap that are connected to each other and that enclose a first cavity, a first pressure prevailing in the first cavity, and a first gas mixture having a first chemical composition being enclosed within the first cavity, the method comprising:

• in a first step, forming in the substrate or in the cap an access opening that connects the first cavity to an environment external to the micromechanical component;
• in a second method step, setting at least one of the first pressure and the first chemical composition in the first cavity;
• in a third method step, laser sealing the access opening by introducing energy or heat into an absorbing part of the substrate or the cap;
• and
• in a fourth method step, which is carried out temporally at least one of before and during the third method step, performing a thermal treatment of the substrate or the cap that reduces temperature gradients in the substrate or in the cap.

A micromechanical component comprising:

• a substrate;
• and
• a cap, wherein:
• the substrate and the cap are connected to each other and enclose a first cavity;
• a first pressure prevails inside the first cavity;
• a first gas mixture having a first chemical composition is enclosed within the first cavity;
• the substrate or the cap includes a sealed access opening and a region around the sealed access opening that features low stresses due to a performed thermal treatment of the substrate or the cap.