Method for cmp pad conditioning
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChunHung CHEN, Sheng-Chen WANG
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Abstract
A method of conditioning a polishing pad includes positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad. The method further includes generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad. The method further includes generating a surface condition signal using an optical scanner. The method further includes adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.
Claims20
A method of conditioning a polishing pad comprising:
- positioning the polishing pad on a platen, the polishing pad having a polishing surface;
- positioning a conditioning head to bring a conditioning pad into contact with the polishing surface;
- generating a first pressure signal from a first pressure sensor, the first pressure signal is based on a force being applied to the polishing surface by the conditioning pad;
- and
- adjusting the positioning of the conditioning pad in response to evaluating the first pressure signal.
A method of conditioning a polishing pad comprising:
- positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad;
- generating a first pressure signal using a first pressure sensor based on a force being applied to the polishing surface by the conditioning pad;
- generating a surface condition signal using an optical scanner;
- and
- adjusting the positioning of the conditioning pad in response to at least one of the first pressure signal or the surface condition signal.
A method of conditioning a polishing pad comprising:
- positioning a conditioning head to bring a conditioning pad into contact with a polishing surface of a polishing pad;
- rotating the conditioning pad relative to the polishing pad;
- generating a pressure signal using a plurality of pressure sensors based on a force being applied to the polishing surface by the conditioning pad during rotation of the conditioning pad;
- and
- adjusting the positioning of the conditioning pad in response to the pressure signal.
Dependencies are inferred from the claim text.