Solder ball feeding device
AssigneePac Tech—Packaging Technologies GmbH
InventorGhassem Azdasht
Life of this patent
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Abstract
The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device.
Claims10
A method for dispensing a metered feeding amount of solder balls from a solder ball reservoir to a discharge device using a solder ball feeding device comprising
- a solder ball reservoir receiving an amount of solder balls and
- a metering device dispensing the metered feeding amount of solder balls;
- wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device applying vibrations to the dispensing nozzle, and the solder ball reservoir being provided with a pressure connection connected to a pressurized gas device and introducing a pressurized gas into the solder ball feeding device, the method comprising:
- applying a pressurized gas to the amount of solder balls received in a receiving chamber of the solder ball reservoir by applying a pressure cushion to the amount of solder balls while simultaneously applying vibrations.
Dependencies are inferred from the claim text.