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US 2020/0266583 A1Published application
Backplane connector omitting ground shields and system using same
AssigneeMolex Incorporated
InventorsJohn C. LAURX, Chien-Lin WANG, Vivek SHAH
Life of this patent
Estimating the term…
Abstract
A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.
Claims14
A backplane connector, comprising:
- a shroud;
- a plurality of wafers supported by the shroud, each wafer of the plurality of wafers including an insulative frame that supports a first terminal pair and a second terminal pair, the first and second terminal pairs each having a first signal terminal and a second signal terminal that form a differential pair, each of the first and second signal terminals having a contact, a tail and a body extending therebetween, the bodies of the first and second signal terminals being edge-coupled and each wafer including a ground shield that provides a U-channel that extends along the body of the signal terminals, wherein the U-channel shields the terminal pair on three sides and wherein the wafer omits separate ground shields and the U-channels of adjacent terminal pairs are electrically connected with a connection frame;
- and
- a plurality of U-shields, each of the U-shields of the plurality of U-shields supported by the shroud and arranged to partially shield the contacts of one of the terminal pairs, the U-shield electrically connected to the U-channel associated with the corresponding terminal pair.
1 more element
A backplane connector, comprising
- a shroud;
- an insert positioned in the shroud, the insert having a conductive element;
- a plurality of wafers supported by the shroud and engaging the insert, each wafer of the plurality of wafers including an insulative frame that supports a first terminal pair and a second terminal pair, the first and second terminal pairs each having a first signal terminal and a second signal terminal that form a differential pair, each of the first and second signal terminals having a contact, a tail and a body extending therebetween, the bodies of the first and second signal terminals being edge-coupled so as to provide the differentially coupled terminal pairs and each wafer including a ground shield that provides a U-channel that extends along the bodies of the signal terminals, wherein the wafer omits separate ground shields and the ground shields engage the insert;
- and
- a plurality of U-shields positioned in the insert, each of the U-shields of the plurality of U-shields arranged to partially shield the contacts of one of the terminal pairs, the U-shield electrically connected to the U-channel associated with the corresponding terminal pair via the insert, wherein each of the ground shields includes a plurality of connection frames, the connection frame electrically connecting adjacent U-channels.
2 more elements
A connector system, comprising:
- a first connector, the first connector including a first shroud that supports a plurality of first wafers, each of the first wafers having a first frame that supports a plurality of first terminal pairs, each of the first terminal pairs including first contacts, and a first ground shield that provides first U-channels associated with and shielding on three sides each of the first terminal pairs, the first connector omitting ground terminals between the first terminal pairs and including a first secondary shield mounted to each of the first ground shields;
- a plurality of U-shields, each of the U-shields configured to shield the first contacts of one of the first terminal pairs;
- and
- a second connector mated to the first connector, the second connector including a second shroud that supports a plurality of second wafers, each of the second wafers having a second frame that supports a plurality of second terminal pairs, each of the second terminal pairs including second contacts, and a second ground shield that provides second U-channels associated with and shielding on three sides each of the second terminal pairs, the second connector omitting ground shields between the second terminal pairs, wherein the connector system is configured to provide at least 45 dB insertion loss to crosstalk ratio (ICR) when measured at 20 GHz.
1 more element
Dependencies are inferred from the claim text.