Memory device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTai-Yen PENG, Hui-Hsien WEI, Wei-Chih WEN, Pin-Ren DAI, Chien-Min LEE, Sheng-Chih LAI, Han-Ting TSAI, Chung-Te LIN
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTai-Yen PENG, Hui-Hsien WEI, Wei-Chih WEN, Pin-Ren DAI, Chien-Min LEE, Sheng-Chih LAI, Han-Ting TSAI, Chung-Te LIN
Estimating the term…
A memory device includes a bottom electrode, a resistance switching element, a capping layer, a top electrode, a first spacer, and a second spacer. The resistance switching element is over the bottom electrode. The capping layer is over the resistance switching element. The top electrode is over the capping layer. The first spacer extends along a sidewall of the resistance switching element. The second spacer extends along a sidewall of the first spacer and beyond a top of the first spacer, in which the second spacer is in contact with the capping layer.
A memory device, comprising:
A memory device, comprising:
A memory device, comprising:
Dependencies are inferred from the claim text.