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US 2020/0266186 A1Published application
Chip, manufacturing method, and mobile terminal
AssigneeGuangdong Oppo Mobile Telecommunications Corp., Ltd.
InventorJian BAI
Life of this patent
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Abstract
In a chip, a manufacturing method, and a mobile terminal, the chip includes a first region and a second region. The first region is formed by at least one first circuit unit set. The second region is formed by a second circuit unit set. The at least one first circuit unit set includes a plurality of identical circuit units. A number of circuit units in the first region determines a specification of the chip and a size of the first region of the chip.
Claims9
A method for manufacturing a plurality of chips, comprising:
- dividing a chip substrate into a plurality of chip regions;
- processing a first region of each of the chip regions for forming at least one first circuit unit set;
- processing a second region of each of the chip regions for forming a second circuit unit set, wherein the at least one first circuit unit set comprises a plurality of same circuit units, a size of the first region of each chip is determined by a number of the same circuit units in the first region, and the number of the same circuit units in the first region determines a specification of the chip;
- and
- cutting the chip substrate for forming a plurality of chips.
2 more elements
Dependencies are inferred from the claim text.