Semiconductor device and method of manufacturing semiconductor device
AssigneeRohm Co., Ltd.
InventorIsamu NISHIMURA
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Abstract
A semiconductor device, includes: a semiconductor element including an element main surface and an element back surface facing opposite sides in a thickness direction; a wiring part electrically connected to the semiconductor element; an electrode pad electrically connected to the wiring part; a sealing resin configured to cover a part of the semiconductor element; and a first metal layer configured to make contact with the element back surface and exposed from the sealing resin, wherein the semiconductor element overlaps the first metal layer when viewed in the thickness direction.
Claims23
A semiconductor device, comprising:
- a semiconductor element including an element main surface and an element back surface facing opposite sides in a thickness direction;
- a wiring part electrically connected to the semiconductor element;
- an electrode pad electrically connected to the wiring part;
- a sealing resin configured to cover a part of the semiconductor element;
- and
- a first metal layer configured to make contact with the element back surface and exposed from the sealing resin,
- wherein the semiconductor element overlaps the first metal layer when viewed in the thickness direction.
A method of manufacturing a semiconductor device, comprising:
- providing a substrate made of a semiconductor material;
- forming a wiring part arranged on the substrate;
- mounting a semiconductor element by electrically connecting the semiconductor element having an element main surface and an element back surface facing opposite sides in a thickness direction to the wiring part such that the element main surface faces the substrate;
- forming a sealing resin that covers the semiconductor element;
- exposing the semiconductor element by removing a part of the sealing resin and exposing the element back surface;
- forming a first metal layer in contact with the element back surface exposed by the sealing resin;
- and
- forming an electrode pad electrically connected to the wiring part.
Dependencies are inferred from the claim text.