Semiconductor package

A method of manufacturing a semiconductor package, the method comprising:

• forming a resin layer on a carrier;
• forming a UBM pad and a passivation layer covering the UBM pad on the resin layer;
• forming a hole exposing a portion of the UBM pad in the passivation layer;
• forming a connection member having a redistribution layer and an insulating layer covering the redistribution layer over the passivation layer, the redistribution layer having a UBM via contacting the exposed portion of the UBM pad through the hole of the passivation layer;
• disposing a semiconductor chip on the connection member such that a connection pad of the semiconductor chip is electrically connected to the UBM pad through the redistribution layer;
• removing the carrier layer from the passivation layer;
• and
• performing a plasma etching process such that the resin layer is removed and a thickness of the passivation layer is reduced, whereby at least a portion of a side surface of the UBM pad is exposed.

A method of manufacturing a semiconductor package, the method comprising:

• forming a sacrificial pattern on a carrier;
• forming a UBM pad covering the sacrificial pattern and a passivation layer covering the UBM pad on the carrier layer;
• forming a hole exposing a portion of the UBM pad in the passivation layer;
• forming a connection member having a redistribution layer and an insulating layer covering the redistribution layer over the passivation layer, the redistribution layer having a UBM via contacting the exposed portion of the UBM pad through the hole of the passivation layer;
• disposing a semiconductor chip on the connection member such that a connection pad of the semiconductor chip is electrically connected to the UBM pad through the redistribution layer;
• removing the carrier layer from the passivation layer;
• and
• etching the sacrificial pattern and the passivation layer such that the sacrificial pattern is removed and a thickness of the passivation layer is reduced, whereby at least a portion of a side surface of the UBM pad is exposed and the UBM pad has a recess corresponding to the sacrificial pattern.