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US 2020/0266117 A1Published application
Semiconductor device, production method therefor, and automobile
AssigneeMitsubishi Electric Corporation
InventorYosuke NAKATA
Life of this patent
Estimating the term…
Abstract
In the semiconductor device, a screw has a head section embedded in a case groove section provided in a frame placing stage of a case to cause side and front surfaces of the head section to be covered by the case, thereby fixing the screw to the case. A threaded section passes through a frame through hole of a frame exposed section disposed above the head section to protrude upward to be exposed on a side facing away from the base plate.
Claims8
A semiconductor device comprising:
- a base plate;
- an insulation substrate provided on the base plate;
- a circuit pattern provided on the insulation substrate;
- a semiconductor element provided on the circuit pattern;
- a frame provided on the semiconductor element to be electrically connected to the semiconductor element;
- and
- a case provided on the base plate to surround the insulation substrate, the circuit pattern, the semiconductor element, and the frame in a housing area, the case having an insulation property, wherein
- the frame includes a frame body section provided in the housing area, and a frame exposed section provided extending from the frame body section to an outside of the housing area and exposed on the case, the frame exposed section including a frame through hole, and
- the semiconductor device further comprising a screw provided to cause a head section to be covered by the case and cause a threaded section to pass through the frame through hole of the frame exposed section to protrude in a direction away from the base plate.
6 more elements
A semiconductor device comprising:
- a base plate;
- an insulation substrate provided on the base plate;
- first and second circuit patterns provided on the insulation substrate;
- a semiconductor element provided on the first circuit pattern;
- a frame provided on the semiconductor element and the second circuit pattern to be electrically connected to the semiconductor element and the second circuit pattern;
- and
- a case provided on the base plate to surround the insulation substrate, the first and second circuit patterns, the semiconductor element, and the frame in a housing area, wherein
- the frame includes a frame body section provided in the housing area, a frame exposed section provided extending from the frame body section to an outside of the housing area and exposed on the case, and a frame bent section further extending from the frame exposed section and extending, after a distal end portion is bent, in a direction opposite to a direction in which the frame exposed section extends, the frame exposed section including a frame through hole, and the frame bent section being connected to the second circuit pattern, and
- a screw is further provided to cause a head section to be covered by the case and cause a threaded section to pass through the frame through hole to protrude in a direction away from the base plate, the screw being supported by the frame bent section from below a front surface of the head section.
6 more elements
Dependencies are inferred from the claim text.