Resin, copper clad laminate made of resin, and printed circuit board

A resin, comprising a compound of the following Formula A:

• wherein Y1 and Y2 each independently include
• a group comprising an alkenyl group, a substituted or unsubstituted aromatic ring or at least include a combination of any one of the above;
• R1 to R4 each independently include H, a substituted or unsubstituted aromatic ring, a substituted or unsubstituted C1 to C5 alkyl group, and a substituted or unsubstituted C1 to C5 alkenyl group, or at least include a combination of any one of the above;
• Z1 and Z2 each independently include a substituted or unsubstituted aromatic ring;
• m and n each independently ranges from 0 to 100, and m and n are not both 0 at the same time;
• R5 and R6 each independently include H,
• or at least include a combination of any one of the above;
• X includes
• or at least includes a combination of any one of the above, p being a positive integer;
• and
• R7 and R8 each independently include H, C1 to C12 alkyl, or CF3, or at least include a combination of any one of the above.