Method and device for repairing a semiconductor chip
AssigneeAsti Global Inc., Taiwan
InventorCHIEN-SHOU LIAO
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AssigneeAsti Global Inc., Taiwan
InventorCHIEN-SHOU LIAO
Estimating the term…
A method for repairing a semiconductor chip and a device for repairing a semiconductor chip is provided, and the method for repairing a semiconductor chip includes: providing a plurality of light-emitting units, and at least one of the light-emitting units being a damaged light-emitting unit; next, removing the damaged light-emitting unit to form an unoccupied position; then, using a pick and place module to obtain a good light-emitting unit from a carrier board; then, a volatile adhesive material is formed on the bottom of the good light-emitting unit; next, the volatile adhesive material is used to adhere the good light-emitting unit to the unoccupied position; finally, the good light-emitting unit is heated so that the good light-emitting unit is fixed onto the unoccupied position.
A method for repairing a semiconductor chip, comprising:
A method for repairing a semiconductor chip, comprising:
A device for repairing a semiconductor chip, wherein the device for repairing a semiconductor chip is applied to an LED module including a circuit substrate and a plurality of light-emitting units disposed on the circuit substrate and electrically connected to the circuit substrate, with at least one of the plurality of light-emitting units being a damaged light-emitting unit, the device comprising:
Dependencies are inferred from the claim text.