US 2020/0221582 A1 · POWER MODULE, CHIP-EMBEDDED PACKAGE MODULE AND MANUFACTURING METHOD OF CHIP-EMBEDDED PACKAGE MODULE

Abstract

The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.

Claims22

Dependent claims

A chip-embedded package module, comprising:

a chip having a first surface and a second surface that are disposed oppositely;
a first plastic member comprising a first cover portion and a first protrusion, wherein the first cover portion covers at least a portion of the first surface of the chip, the first protrusion covers a side surface of the chip, and a top surface of the first protrusion is coplanar with the second surface of the chip;
and
a second plastic member comprising a second cover portion and a second protrusion, wherein the second cover portion covers at least a portion of the second surface of the chip, the second protrusion is disposed on the side surface of the chip, and a top surface of the second protrusion is not coplanar with the second surface of the chip.

1 more element

A manufacturing method of a chip-embedded package module, comprising:

providing a chip;
pressing a first plastic member on a first surface of the chip in such a manner that a first cover portion of the first plastic member covers at least a portion of the first surface of the chip, and a first protrusion of the first plastic member covers a side surface of the chip, and the top surface of the first protrusion is coplanar with a second surface of the chip;
and
pressing a second plastic member on the second surface of the chip in such a manner that a second cover portion of the second plastic member covers at least a portion of the second surface of the chip, a second protrusion of the second plastic member is located on the side surface of the chip, and the top surface of the second protrusion is not coplanar with the second surface of the chip.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

16/731,078Filed 31 Dec 2019

Priority

CN 201910013049.37 Jan 2019

Published

9 Jul 2020

Term ends

Not estimatedThe source records don’t support an estimate.

Classification27 codes

H05K 1/0271
Details: arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal…
H05K 3/40
Apparatus or processes for manufacturing printed circuits: forming printed elements for providing electric connections to or between printed circuits
H05K 3/4697
Manufacturing multilayer circuits: having cavities, e.g. for mounting components
H05K 7/06
Arrangements of circuit components or wiring on supporting structure: on insulating boards , e.g. wiring harnesses

Power module, chip-embedded package module and manufacturing method of chip-embedded package module

Life of this patent

Power module, chip-embedded package module and manufacturing method of chip-embedded package module

Life of this patent

Abstract

Claims22