Ic with ion milled thin-film resistors
AssigneeTexas Instruments Incorporated
InventorsBHASKAR SRINIVASAN, BRIAN GOODLIN, DHISHAN KANDE
Life of this patent
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Abstract
A method of fabricating an integrated circuit (IC) includes providing a substrate having a semiconductor surface layer comprising an unpatterned resistive layer. Measurements are obtained of a characteristic of the unpatterned resistive layer at each of a plurality of locations over the substrate. The unpatterned resistive layer is modified, such as by targeted removal of layer material, in response to the measurements such that the measured characteristic is more uniform across the substrate. A resistor on the IC is defined from the unpatterned resistive layer after the modifying.
Claims21
A method of fabricating an integrated circuit (IC), comprising:
- providing a substrate comprising a plurality of instances of the IC at an intermediate stage of fabrication with a dielectric layer over a metal layer above the substrate;
- forming an unpatterned resistive layer over the dielectric layer;
- obtaining measurements of a measured characteristic of the unpatterned resistive layer at each of a plurality of locations over the substrate;
- modifying the unpatterned resistive layer in response to the measurements such that the measured characteristic is more uniform across the substrate after the modifying;
- and
- defining a resistor on each of one or more instances of the IC from the unpatterned resistive layer after the modifying, wherein the resistor is electrically connected to a corresponding circuit component on each of the one or more instances.
A method of fabricating an integrated circuit (IC), comprising:
- forming an unpatterned resistive layer over a substrate;
- obtaining measurements of a characteristic of the unpatterned resistive layer at each of a plurality of locations over the substrate;
- modifying the unpatterned resistive layer in response to the measurements such that the characteristic is more uniform across the substrate after the modifying, and
- defining a resistor over the substrate from the unpatterned resistive layer after the modifying.
19-20. (canceled)
Dependencies are inferred from the claim text.