Methods for forming microwave tunable composited thin-film dielectric layer
AssigneeApplied Materials, Inc.
InventorsYueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Guan Huei See, Felix Deng
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AssigneeApplied Materials, Inc.
InventorsYueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Guan Huei See, Felix Deng
Estimating the term…
Methods of curing a polymer layer on a substrate using variable microwave frequency are provided herein. In some embodiments, methods of curing a polymer layer on a substrate using variable microwave frequency include (a) forming a first thin-film polymer layer on a substrate, the first thin-film polymer layer including at least one first base dielectric material and at least one microwave tunable material, (b) applying a variable frequency microwave energy to the substrate and the first thin-film polymer layer to heat the substrate and the first thin-film polymer layer to a first temperature, and (c) adjusting the variable frequency microwave energy applied to the substrate and the first thin-film polymer layer to tune at least one material property of the first thin-film polymer layer.
A method of curing a polymer layer on a substrate using variable microwave frequency, comprising:
A method of curing a polymer layer on a substrate using variable microwave frequency, comprising:
A method of curing a plurality of polymer layers on a substrate using variable microwave frequency, comprising:
Dependencies are inferred from the claim text.