Back to results
US 2020/0185875 A1Published application
Optoelectronic assembly
AssigneeFinisar Corporation
InventorsDavid Allouche, Michael Chu, Brian R. Carey, Jonathan Ashbrook, Anita Chan, Krzysztof Szczerba
Life of this patent
Estimating the term…
Abstract
An optoelectronic assembly is disclosed. The disclosed assembly includes one or more lasers formed on a first substrate, and a programmable driver circuit formed on a second substrate configured as an integrated circuit. The first and second substrates are mounted on a third substrate in a stacked arrangement.
Claims10
An optoelectronic assembly comprising:
- one or more optical emitters each configured to emit an optical signal in response to a laser drive current, the one or more optical emitters each disposed on an emitter substrate;
- and
- a driver circuit configured to generate the laser drive current for use by the one or more laser devices so as to produce one or more optical signals having one or more predetermined wave form characteristics, the wave form characteristics stored in a memory component, the driver circuit and the memory component disposed on a common integrated circuit substrate;
- wherein the emitter substrate is operably mounted directly to the integrated circuit substrate, and the integrated circuit substrate is operably mounted directly to a printed circuit board (PCB) in a manner so that the emitter substrate, the integrated circuitry substrate and the PCB are positioned in a stacked arrangement with respect to one another.
1 more element
The optoelectronic assembly of claim 6, wherein the one or more conductive pillars comprise copper (Cu).
Dependencies are inferred from the claim text.