Substrate processing system, substrate processing method and computer-readable recording medium
AssigneeTokyo Electron Limited
InventorsMunehisa KODAMA, Takahiro SAKAMOTO
Life of this patent
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Abstract
A substrate processing method of thinning a substrate having a protective tape attached on a front surface thereof includes measuring a thickness of the protective tape; and grinding, by using a grinder, a rear surface of the substrate held by a substrate holder.
Claims20
A substrate processing system configured to thin a substrate, the substrate processing system comprising:
- a substrate holder configured to hold the substrate;
- a grinder configured to perform a grinding of the substrate held by the substrate holder;
- a rotation shaft connected to the substrate holder and configured to rotate the substrate holder;
- a driving device provided independently from the rotation shaft and configured to apply a rotational driving force for rotating the substrate holder;
- and
- a driving force transmitter configured to deliver the rotational driving force by the driving device to the rotation shaft and configured not to deliver an inclination of the rotation shaft to the driving device,
- wherein the substrate is ground by bringing the grinder into contact with the substrate in a state that the rotation shaft is tilted.
A substrate processing method of thinning a substrate, the substrate processing method comprising:
- grinding, by using a grinder, the substrate held by a substrate holder,
- wherein, in the grinding of the substrate, the substrate is ground by bringing the grinder into contact with the substrate while rotating the substrate held by the substrate holder by a rotation shaft connected to the substrate holder in a state that the rotation shaft is tilted,
- a rotation driving force for rotating the substrate holder is applied by a driving device provided independently from the rotation shaft, and
- the rotation driving force by the driving device is delivered to the rotation shaft by a driving force transmitter, and the driving force transmitter is configured not to deliver an inclination of the rotation shaft to the driving device.
A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a substrate processing system to perform a substrate processing method of thinning a substrate,
- wherein the substrate processing method comprises:
- grinding, by using a grinder, the substrate held by a substrate holder,
- wherein, in the grinding of the substrate, the substrate is ground by bringing the grinder into contact with the substrate while rotating the substrate held by the substrate holder by a rotation shaft connected to the substrate holder in a state that the rotation shaft is tilted,
- a rotation driving force for rotating the substrate holder is applied by a driving device provided independently from the rotation shaft, and
- the rotation driving force by the driving device is delivered to the rotation shaft by a driving force transmitter, and the driving force transmitter is configured not to deliver an inclination of the rotation shaft to the driving device.
Dependencies are inferred from the claim text.