US 2020/0101764 A1 · SUBSTRATE PACKAGE HAVING VARIABLE MARKING

Abstract

Disclosed are a substrate package, a method of fabricating the substrate package, and a system including the substrate package. The substrate package includes a stack of substrate sheets in an individual form, a continuous form, or a roll form. The stack has a sidewall defined by edges of the substrate sheets and a mark on the sidewall includes mark segments on respective edges. The mark segments vary such that one or more of the mark segments have a respective segment characteristic, such as a length. The segment characteristic can encode information about an attribute of the substrate sheet, such as a physical characteristic of the sheet.

Claims22

Dependent claims

A substrate package, comprising:

one or more substrate sheets arranged in a stack, wherein the stack has a sidewall defined by edges of the one or more substrate sheets;
and
a mark on the sidewall, wherein the mark includes a plurality of mark segments on the edges and along a mark axis, e mark varies along the mark axis, and wherein segment characteristics of the plurality of mark segments vary along the mark axis such that a mark segment on an edge of a substrate sheet has a segment characteristic specific to an attribute of the substrate sheet, wherein the one or more substrate sheets have respective faces, and wherein the plurality of mark segments extend from the edges onto the faces.

Dependencies are inferred from the claim text.

Substrate package having variable marking

Life of this patent

Substrate package having variable marking

Life of this patent

Abstract

Claims22