Method of selecting semiconductor chips

A method of selecting semiconductor chips comprising:

• A) providing the semiconductor chips in a composite,
• B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film,
• C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation,
• D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and
• E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.

A method of selecting semiconductor chips comprising:

• A) providing the semiconductor chips in a composite,
• B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film,
• C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation,
• D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, and
• E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.