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US 2020/0050100 A1Published application
Pellicle for EUV Mask and Fabrication Thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Tsung Shih, Shinn-Sheng Yu, Jeng-Horng Chen, Anthony Yen
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Abstract
The present disclosure provides a method in accordance with some embodiments. A wafer is grinded from a back side. The wafer is inserted into an opening defined by a frame holder. The frame holder is attached to a carrier through a temporary layer. A front side of the wafer is attached to the temporary layer. Thereafter, the wafer is etched from the back side until the wafer reaches a predetermined thickness. Thereafter, the frame holder and the wafer therein are separated from the temporary layer and the carrier.
Claims9
A method, comprising:
- providing a frame holder that defines an opening, wherein the frame holder is attached to a carrier through a bonding layer;
- attaching an apparatus to the bonding layer through the opening;
- and
- detaching the apparatus and the frame holder from the bonding layer, thereby forming a pellicle.
1 more element
Dependencies are inferred from the claim text.