Plated Material and Manufacturing Method Therefor

A method of manufacturing electroplated articles comprising:

• a step of supplying, into an electroplating tank, base members each of which including one or more base member-metallic elements;
• and
• a step of flowing the base members in a circumference direction and electroplating the base members in the electroplating tank so that an electroplated layer is formed directly on the base member, the electroplated layer including at least a first electroplated layer-metallic element and a second electroplated layer-metallic element that is different from the first electroplated layer-metallic element, wherein
• the second electroplated layer-metallic element is a metallic element that is identical to at least one of the one or more base member-metallic elements,
• a ratio of the second electroplated layer-metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer, and
• alloy grains including at least the first and second electroplated layer-metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer.

An electroplated article comprising:

• a base member that includes one or more first metallic elements:
• and
• an electroplated layer that is formed directly on the base member, the electroplated layer including at least a second metallic element and a third metallic element that is different from the second metallic element, wherein
• the third metallic element is a metallic element that is identical to at least one of the one or more first metallic elements,
• a ratio of the third metallic element in the electroplated layer is continuously decreased as being away from the base member in the thickness direction of the electroplated layer, and
• alloy grains including at least the second and third metallic elements are distributed in the electroplated layer such that a clear interface is not formed between the base member and the electroplated layer.