Retainer

A retainer, configured to be mounted on a heat dissipation module and to fix the heat dissipation module onto a chip platform, the retainer comprising:

• a pressing portion, configured to press against the heat dissipation module;
• a first latching portion, connected to a first end of the pressing portion, wherein;
• and
• a second latching portion, connected to a second end of the pressing portion,
• wherein
• a first long side of the first latching portion is substantially perpendicular to a long side of the pressing portion,
• a second long side of the second latching portion is substantially perpendicular to the long side of the pressing portion, the first latching portion having a first latching end and the second latching portion have a second latching end, the first latching end and the second latching end being configured to be respectively detachably engaged at two opposite sides of the chip platform, and
• the pressing portion comprises an empty space between the first end and the second end.

A system comprising:

• a retainer;
• and
• a heat dissipation module,
• wherein:
• the retainer comprises
• a pressing portion, having a first end and a second end opposite to each other and configured to press against the heat dissipation module, the pressing portion comprising an empty space between the first end and the second end,
• a first latching portion connected to the first end of the pressing portion, a first long side of the first latching portion being substantially perpendicular to a long side of the pressing portion, and
• a second latching portion connected to the second end of the pressing portion, a second long side of the second latching portion being substantially perpendicular to the long side of the pressing portion;
• the first latching portion has a first latching end and the second latching portion has a second latching end;
• and
• the first latching end and the second latching end are configured to be respectively detachably engaged at two opposite sides of the chip platform.

A method of fixing a heat dissipation module onto a chip platform, the method comprising:

• mounting a retainer on the heat dissipation module, the retainer comprising
• a pressing portion,
• a first latching portion, comprising a flat portion and a flexible curved portion which are connected to each other, the flexible curved portion is located between and connected to a first end of the pressing portion and the flat portion, wherein a long side of the flat portion of the first latching portion is substantially perpendicular to a long side of the pressing portion, and
• a second latching portion, connected to a second end of the pressing portion, wherein a long side of the second latching portion is substantially perpendicular to the long side of the pressing portion,
• wherein the pressing portion comprises an empty space between the first end and the second end;
• detachably engaging the flat portion of the first latching portion and the second latching portion at two opposite sides of the chip platform;
• deforming the flexible curved portion;
• and
• utilizing the deformation of the flexible curved portion to enhance a pressing force of the pressing portion applied to the heat dissipation module.