Microelectronics package with a combination heat spreader/radio frequency shield

A microelectronics package comprising:

• a base package including a central processing unit (CPU);
• an ancillary package including a memory die, the ancillary package located on top of the base package;
• and
• an electrically isolated metal layer located at least partially within a layer of the base package such that a portion of the electrically isolated metal layer contacts at least one surface of the CPU and is located in between the CPU and the memory die.

A microelectronics package comprising:

• a base package including a central processing unit (CPU);
• an ancillary package including a transceiver integrated circuit, the ancillary package located on top of the base package;
• and
• an electrically isolated metal layer located at least partially within a layer of the base package such that a portion of the electrically isolated metal layer contacts at least one surface of the CPU and is located in between the CPU and the transceiver integrated circuit.