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AssigneeNGK Insulators, Ltd.
InventorsMasaru NOMURA, Sugio MIYAZAWA
Estimating the term…
A temporary-fixing substrate includes a fixing face for adhering and temporary fixing a plurality of electronic parts by a resin mold on the fixing face and a bottom face on the opposite side of the fixing face. The temporary-fixing substrate is warped so that the fixing face is of a convex shape curved upwardly from the temporary-fixing substrate viewed in a cross section of the temporary-fixing substrate. The following formula (1) is satisfied, provided that W is assigned to a width of the fixing face viewed in the cross section of the temporary-fixing substrate, and provided that W3/4 is assigned to a width of a region in which heights of the fixing face with respect to a reference plane of warping of the temporary-fixing substrate are ¾ or larger of the maximum value of the heights of the fixing face with respect to the reference plane. 0.45≤W3/4/W≤0.55 (1)
A temporary-fixing substrate comprising a fixing face for adhering and temporary fixing a plurality of electronic parts by a resin mold on said fixing face and a bottom face on the opposite side of said fixing face;
A method of temporary-fixing electric parts, the method comprising the steps of:
Dependencies are inferred from the claim text.