Module

A module comprising:

• a wiring substrate;
• a component that is mounted on one main surface of the wiring substrate;
• a metal pin that has one end surface that is attached to an electrode provided at the one main surface and that includes a first extending portion that extends from the one end surface away from the one main surface, a second extending portion that is bent and extends from one end of the first extending portion on an opposite side from the one end surface, and a third extending portion that is bent and extends from one end of the second extending portion on an opposite side from the first extending portion so as to approach the one main surface;
• a sealing resin layer that covers the one main surface, the component, and the metal pin except for at least a part of the extending portions;
• and
• a shield layer that covers a side surface of the wiring substrate and a surface of the sealing resin layer;
• wherein the shield layer contacts the part of the extending portions that is not covered by the sealing resin layer.