Package-integrated vertical capacitors and methods of assembling same

A capacitor cell, comprising:

• a semiconductor package substrate portion;
• a first capacitor plate, wherein the first capacitor plate is a first partial right cylinder;
• a first electrode and a first trace, wherein the first electrode contacts the first trace, wherein the first trace contacts the first capacitor plate, and wherein the semiconductor package substrate portion contacts the first electrode, the first trace and the first capacitor plate;
• a dielectric material that contacts the first capacitor plate on a concave portion of the partial right cylinder;
• a second capacitor plate, wherein the second capacitor plate is part of an adjacent second partial right cylinder;
• and
• a second electrode and a second trace, wherein the second electrode contacts the second trace, wherein the second trace contacts the second capacitor plate, and wherein the semiconductor package substrate portion contacts the second electrode, the second trace and the adjacent second partial right cylinder.