Semiconductor device and method for manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei YAMAZAKI, Yuta ENDO, Shinya SASAGAWA, Shuhei NAGATSUKA
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei YAMAZAKI, Yuta ENDO, Shinya SASAGAWA, Shuhei NAGATSUKA
Estimating the term…
A favorable semiconductor device for miniaturization and high integration is provided. One embodiment of the present invention includes a first oxide including a first region and second region adjacent to each other, a third region and a fourth region with the first region and the second region provided therebetween, a second oxide over the first region, a first insulator over the second oxide, a first conductor over the first insulator, a second insulator over the second oxide and on side surfaces of the first insulator and the first conductor, a third insulator over the second region and on a side surface of the second insulator, and a second conductor over the second region with the third insulator provided therebetween. A part of the third insulator is positioned between the second conductor and the side surface of the second insulator.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.