Integrated circuit system and packaging method therefor

An integrated circuit system packaging method, comprising steps of:

• curing, comprising:
• providing a first carrier and a second carrier opposite to each other, wherein a first device set of the first carrier and a second device set of the second carrier are both located between the first carrier and the second carrier,
• providing a molding material between the first carrier and the second carrier, wherein the first device set and the second device set are respectively in contact with the molding material, and
• curing the molding material, so that the first device set and the second device set are respectively mounted at two sides of the molding material;
• detaching, comprising:
• detaching the first carrier from the first device set and the molding material, and detaching the second carrier detached from the second device set and the molding material;
• and
• connecting, comprising:
• forming connection holes in the molding material, and
• forming a conductive layer in such a way that the conductive layer extends into the connection holes, wherein the conductive layer enables the first device set to be electrically connected with the second device set.