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US 2020/0006287 A1Published application
Package structure having substrate thermal vent structures for inductor cooling
AssigneeIntel Corporation
InventorsMichael J. HILL, Leigh E. WOJEWODA, Mathew MANUSHAROW, Siddharth KULASEKARAN
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Abstract
Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein the inductor is at least partially embedded within the substrate. One or more thermal vent structures extend through at least one of the substrate or a board attached to the substrate. The one or more thermal vent structures provide a thermal pathway for cooling for the inductor.
Claims20
An assembly comprising:
- a substrate, the substrate comprising a first side and a second side opposite the first side;
- a die on the first side of the substrate, the die comprising an integrated circuit;
- an inductor, wherein the inductor is at least partially embedded within the substrate;
- a board electrically coupled to the second side of the substrate;
- and
- one or more openings extending through at least one of the substrate or the board, wherein the one or more openings are adjacent a sidewall of the inductor.
3 more elements
A microelectronic device package structure comprising:
- a substrate;
- a die comprising an integrated circuit, wherein the die is on a first side of the substrate;
- an inductor, wherein the inductor is at least partially embedded within the substrate;
- and
- one or more openings extending through the substrate, wherein the one or more openings are adjacent a sidewall of the inductor.
2 more elements
A method of fabricating a microelectronic package structure, comprising:
- forming an inductor within a substrate, wherein the inductor is at least partially embedded within the substrate;
- and
- forming one or more openings through the substrate, wherein the one or more openings are adjacent a sidewall of the inductor.
Dependencies are inferred from the claim text.