Microelectronic device interconnect structure

A method of forming a microelectronic device, comprising:

• engaging a first interconnect structure having deformable material formed on respective conductive pads with a second interconnect structure having multiple contacts configured to couple to the deformable material of the first interconnect structure;
• wherein the multiple contacts of the second interconnect structure each include a respective first contact surface and a protrusion extending outwardly from the first contact surface in the direction of the first interconnect structure;
• and
• wherein engaging the first interconnect structure with the second interconnect structure comprises establishing physical contact between at least a portion of the protrusions of the contacts of the second interconnect structure and the deformable material of the first interconnect structure.

An electronic system, comprising:

• a microelectronic device, comprising:
• a first interconnect structure comprising first multiple contact structures on a first surface;
• a second interconnect structure comprising second multiple contact structures on a second surface in positions to be coupled to respective first multiple contact structures, the second multiple contact structures each having,
• a respective first portion with a first lateral dimension proximate a dielectric structure of the second interconnect structure, and
• a protrusion extending in a direction toward the first interconnect structure, the protrusion having a second portion with a second lateral dimension less than the first lateral dimension of the first portion of the contact structure;
• and
• a deformable material establishing electrical and mechanical contact between the first multiple contact structures the first interconnect structure and respective second multiple contact structures of the second interconnect structure;
• and
• wherein at least one of the first and second interconnect structures comprises a processor;
• and
• at least one of an additional semiconductor device, a mass storage device, and a network interface operably coupled to the microelectronic device.