Heat dissipation structures

A method, comprising:

• attaching one or more chips in a first region of a substrate, wherein the substrate with the one or more chips forms a first chip layer;
• depositing a thermal interface material on a second region of substrate, wherein the thermal interface material forms a closed loop around the one or more chips;
• forming one or more thermally conductive structures on the thermal interface material;
• and
• depositing a dielectric layer on the substrate so that the one or more chips and thermally conductive structures are embedded in the dielectric layer.

A structure, comprising:

• a bottom chip layer;
• and
• a stack of dies over the bottom chip layer, wherein the stack comprises:
• interconnect layers configured to provide interconnects for the dies, wherein the interconnect layers comprise first thermally conductive vertical structures;
• and
• a molding region surrounding each die in the stack, wherein the molding region comprises second thermally conductive vertical structures and a thermal interface material.