Heat transfer structure, power electronics module, cooling element, method of manufacturing a heat transfer structure and method of manufacturing a power electronics component
OwnerJorma Manninen, Mika Silvennoinen +1inventors
InventorsJorma Manninen, Mika Silvennoinen, Kjell Ingman
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Abstract
The present application relates to a heat transfer structure, power electronics module, cooling element and methods of manufacturing a heat transfer structure and a power electronics component. A heat transfer structure is utilized in a power electronics module. The heat transfer structure includes a metallic body and a carbon based insert.
Claims35
A heat transfer structure, wherein the structure comprises:
- a metallic body having a first surface and a second surface, wherein the first surface and the second surface are opposing surfaces, one of the first surface and the second surface is adapted to receive a heat generating component, and wherein
- the metallic body comprises a carbon based insert.
A power electronics module comprising:
- at least one power electronics component, wherein the power electronics module comprises a base plate for transferring heat generated by the at least one power electronics component to a cooling device, the base plate being a metallic body having a first surface and a second surface, wherein
- the first surface and the second surface are opposing surfaces,
- one of the first surface and the second surface is adapted to receive the at least one power electronics component, and wherein
- the metallic body comprises a carbon based insert.
A cooling element comprising:
- a heat receiving body, wherein the heat receiving body is a metallic body having a first surface and a second surface, wherein
- the first surface and the second surface are opposing surfaces,
- one of the first surface and the second surface is adapted receive a heat generating component, and
- the metallic body comprises a carbon based insert.
A method of manufacturing a heat transfer structure, the method comprising
- providing a metallic body having a first surface and a second surface, the first surface and the second surface are opposing surfaces, and one of the first surface and the second surface is adapted to receive a heat generating component, and
- providing a carbon based insert in the metallic body.
A method of manufacturing a power electronics module, the method comprising
- providing a substrate structure with at least one semiconductor chip,
- providing a base plate having a metallic body with a carbon based insert, and
- attaching the substrate structure to the base plate.
Dependencies are inferred from the claim text.