Semiconductor device including reinforced corner supports

A semiconductor device, comprising:

• a substrate, the substrate comprising:
• solder balls configured to couple the semiconductor device to a host device, and
• one or more structural billets at each of the corners of the substrate, the one or more structural billets having a higher strength than the solder balls;
• and
• one or more semiconductor die coupled to the substrate.

A semiconductor device, comprising:

• a substrate;
• one or more semiconductor die coupled to the substrate;
• and
• molding compound around the one or more semiconductor die;
• wherein screw holes are formed at corners of the semiconductor device, through the substrate and molding compound, the screw holes configured to receive screws for screwing the semiconductor device down onto a host device.

A semiconductor device, comprising:

• a substrate, the substrate comprising:
• solder balls configured to couple the semiconductor device to a host device, and
• structural support means for structurally supporting the semiconductor device on a host device, the structural support means provided at corners of the substrate and having a higher strength than the solder balls;
• and
• one or more semiconductor die coupled to the substrate.