Semiconductor device including through-package debug features
AssigneeWestern Digital Technologies, Inc.
InventorsNir Amir, Avichay Hodes
Life of this patent
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Abstract
A semiconductor device is disclosed including through-package debug features enabling debug of a BGA package while mounted to a printed circuit board or other host device. In one example, the through-package debug features are filled or plated vias extending from a surface of the semiconductor device, through a device housing, down to test pads on the substrate. In another example, the through-package debug features are open channels formed from a surface of the semiconductor device.
Claims28
A semiconductor device, comprising:
- a semiconductor die;
- a substrate including one or more test pads, the semiconductor die mounted on the substrate, the one or more test pads electrically coupled to one or more debug ports on the semiconductor die;
- a housing encasing the semiconductor die, the housing having a surface;
- one or more debug features having a first end at the surface of the housing and a second end terminating at the one or more test pads within the housing, the one or more debug features configured to receive a probe for debugging or testing the semiconductor device.
A semiconductor device, comprising:
- a semiconductor die;
- a substrate including one or more test pads, the semiconductor die mounted within a keep-out area on the substrate, the one or more test pads electrically coupled to one or more debug ports on the semiconductor die;
- molding compound encasing the semiconductor die, the molding compound having a surface;
- one or more debug features formed through the molding compound, outside of the keep-out area, the one or more debug features having a first end at the surface of the molding compound and a second end in contact with the one or more test pads, the one or more debug features configured to receive a probe for debugging or testing the semiconductor device.
A method of debugging a semiconductor device mounted on a host device, the method comprising:
- (a) electrically coupling a probe with a test pad within the semiconductor device using a debug feature having a first end at a surface of the semiconductor device and a second end terminating at the test pad within the semiconductor device;
- (b) supplying test data to circuitry within the semiconductor device via the probe;
- and
- (c) measuring output data resulting from the test data.
A semiconductor device, comprising:
- a semiconductor die;
- a substrate including one or more test pads, the semiconductor die mounted on the substrate, the one or more test pads electrically coupled to one or more debug ports on the semiconductor die;
- a housing encasing the semiconductor die, the housing having a surface;
- debugging means for allowing debugging or testing of the semiconductor device, the debugging means having a first end at the surface of the housing and a second end terminating at the one or more test pads within the housing.
Dependencies are inferred from the claim text.