Methods of detecting bonding between a bonding wire and a bonding location on a wire bonding machine
AssigneeKulicke and Soffa Industries, Inc.
InventorGary S. Gillotti
Life of this patent
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Abstract
A method of determining a bonding status between wire and at least one bonding location of a semiconductor device is provided. The method includes the steps of: (a) bonding a portion of wire to at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine; and (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a predetermined height range, thereby determining if the portion of wire is bonded to the at least one bonding location.
Claims25
A method of determining a bonding status between wire and at least one bonding location of a semiconductor device, the method comprising the steps of:
- (a) bonding a portion of wire to the at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine;
- and
- (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a predetermined height range, thereby determining if the portion of wire is bonded to the at least one bonding location.
A method of determining a bonding status between wire and at least one bonding location of a semiconductor device, the method comprising the steps of:
- (a) bonding a portion of wire to the at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine;
- and
- (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a non-stick height range.
A method of determining a bonding status between wire and at least one bonding location of a semiconductor device, the method comprising the steps of:
- (a) bonding a portion of wire to the at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine;
- and
- (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a bonded height range, thereby determining if the portion of wire is bonded to the at least one bonding location.
A method of determining a bonding status between wire and at least one bonding location of a semiconductor device, the method comprising the steps of:
- (a) bonding a portion of wire to the at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine;
- and
- (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire within a missing wire height range, thereby determining if the portion of wire is bonded to the at least one bonding location.
A method of determining a bonding status between wire and at least one bonding location of a semiconductor device, the method comprising the steps of:
- (a) bonding a portion of wire to the at least one bonding location of a semiconductor device using a bonding tool of a wire bonding machine;
- (b) detecting whether another portion of wire engaged with the bonding tool, and separate from the portion of wire, contacts the portion of wire in a non-stick height range;
- (c) if the another portion of wire engaged with the bonding tool does not contact the portion of wire in the non-stick height range in connection with step (b), detecting whether the another portion of wire engaged with the bonding tool contacts the portion of wire in a bonded height range that is lower than the non-stick height range;
- and
- (d) if the another portion of wire engaged with the bonding tool does not contact the portion of wire in the bonded height range in connection with step (c), detecting whether the another portion of wire engaged with the bonding tool contacts the bonding location in a missing wire range that is lower than the bonded height range.
Dependencies are inferred from the claim text.